I do think it will. Would be crazy for me to be doing things to this extent if I believed nothing could come from it. But until its all back together and powered up, I can't say how much of a difference. Of course its not 'just' better thermal pads as there will be air flow convection cooling thru-the-case that's lacking now and I expect that will contribute significantly as well. All insulating plating removed should nicely compliment things as will black anodizing the case inside & out then stripping all existing heat-retentive powder coat & paint from radiant and conductive heat dissipating components and anodizing them. Every little bit helps and effects are cumulative. What I'd like to see is near 30*C temps across the board when run wide open. If I sense or perceive it too cool for proper SQ I could always start to incrementally block-off inlets or outlets which would act like a thermostat internally. If I get REALLY lucky I might even be able to raise or lower temps selectively by 'zones' on digital & analog boards or PSU individually... but that could prove a pipe dream. I've almost no doubt there will be some improvement temp-wise. Just can't say where most will come from or how effective they'll be yet. But we're gonna find out!
Statements in my posts are opinion only, not to be construed as fact. Any projects I engage in are at my own risk! Their outcome cannot be assured and may result in success, small/no change or catastrophic failure. I encourage no one rely on anything I say or do as gospel and to realize your mileage may vary!
