01-Sep-2015, 06:36
This is something that can be put off awhile as 100% of the EMI/RFI generating components are on the underside of the primary PCB and on top of the digital board. That means all components targeted for shielding can be done post-anodizing with removal of the belly pan, ie; no small electronic components are between Devialet internal case ceiling and primary PCB under the Devialet enclosure top as that's the smooth back-side of the primary PCB. The digital board on the other hand is mounted component-side up but there's no hardware, screws etc holding it to the primary board when the belly pan is removed. At that time only the heat-transfer pad keeps it from falling free of the belly pan floor. I can see the benefit of this but its something I need to spend some serious time mulling over placements.
And I can tell by re-reading my first paragraph above it will confuse some. So let me say when the Devialet is sitting normally on a desk, shelf etc with GUI on top, the primary PCB and all 2nd story boards are mounted in the Devialet upside down while the digital board is right side up. That should make the above paragraph little easier to understand what I was trying to say.
And I can tell by re-reading my first paragraph above it will confuse some. So let me say when the Devialet is sitting normally on a desk, shelf etc with GUI on top, the primary PCB and all 2nd story boards are mounted in the Devialet upside down while the digital board is right side up. That should make the above paragraph little easier to understand what I was trying to say.
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